Power chips are attached to external circuits with product packaging, and their efficiency depends on the assistance of the packaging. In high-power scenarios, power chips are typically packaged as power components. Chip affiliation refers to the electric link on the top surface of the chip, which is normally aluminum bonding wire in standard components. ^
Conventional power component package cross-section
At present, business silicon carbide power components still primarily use the packaging modern technology of this wire-bonded conventional silicon IGBT module. They face problems such as large high-frequency parasitical specifications, insufficient warmth dissipation ability, low-temperature resistance, and inadequate insulation strength, which limit making use of silicon carbide semiconductors. The display screen of exceptional performance. In order to fix these troubles and fully exploit the big prospective benefits of silicon carbide chips, several new product packaging innovations and solutions for silicon carbide power modules have actually emerged in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold cords to copper wires, and the driving pressure is expense reduction; high-power tools have actually created from aluminum cords (strips) to Cu Clips, and the driving force is to improve item efficiency. The greater the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a strong copper bridge soldered to solder to link chips and pins. Compared with conventional bonding product packaging techniques, Cu Clip technology has the adhering to advantages:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain level, changes the basic wire bonding approach between the chip and the pins. Consequently, a distinct bundle resistance value, greater existing circulation, and far better thermal conductivity can be gotten.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the cost of silver plating and inadequate silver plating.
3. The item look is completely regular with normal products and is mostly used in servers, mobile computer systems, batteries/drives, graphics cards, motors, power supplies, and various other fields.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is more costly and intricate, but it can accomplish far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding approach
The source pad utilizes a Clip approach, and eviction uses a Cable approach. This bonding approach is somewhat less costly than the all-copper bonding method, saving wafer area (relevant to really little entrance areas). The process is easier than the all-copper bonding technique and can obtain far better Rdson and far better thermal result.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding thick copper wire, please feel free to contact us and send an inquiry.
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